Chipse | T300 |
Category | Cat.4+ |
Factor | LGA |
Size(mm) | 32*29*2.4 |
Weight | ~12g |
NR |
n2/n5/n7/n12/n13/n14/n25/n26/n30/n38/ n41(194M)/n48/n66/n70/n71/n77/n78 |
LTE FDD |
B2/B4/B5/B7/B12/B13/B14/ B17/B25/B26/B30/B66/B71 |
LTE TDD | B38/B41/B42/B43/B48 |
WCDMA | NA |
Antenna | 2(Main +Div)+ 1 (GNSS, optional) |
Operating Voltage | TBD |
Operating Temperature | -30 C ~ +75 C |
Storage tempreture | -40 C ~ +85 C |
2CA(DL): | NA |
AT Command Set |
3GPP TS 27.007 and 27.005 Proprietary FIBOCOM AT Commands |
NR(SA) | Max.227Mbps(DL) /Max. 122Mbps(UL |
EN-DC | NA |
LTE | Max.150Mbps(DL) / Max.75Mbps(UL) |
WCDMA | NA |
Support for built-in eSIM (Secure encryption) |
optional |
optional (U) SIM card to test |
● |
DFOTA | ● |
USB | USB2.0 x 1 |
PCIe | PCIe Gen2 |
UART | ● |
SPI | ● |
UICC | X2 |
GPIO | ● |
SDIO | ● |
PCM | ● |
SGMII | ● |
Regulation | TBD |