Fibocom's 5G module FG360-JP is a series of 5G communication modules for Japanese Market, which supports both 5G SA and NSA network architectures with faster transmission speed, better carrying capacity, and lower network latency.
FG360 is equipped with MTK T750 chip, adopting 7nm manufacturing process. It supports 5G NR sub-6GHz dual-carrier convergence (2CC CA) 200MHz frequency. FG360 has a built-in 4-core ARM Cortex-A55 CPU, supporting two 2.5Gbps SGMII interfaces, a variety of LAN port configurations, and a variety of Wi-Fi configurations, providing a complete set of CPE, gateway and other complete machine solutions.
Package | LGA |
Dimension(mm) | 41x44x2.75 |
Sub-6 | n3/77/78/79 |
mmWave | NA |
LTE FDD | B1/3/19/28 |
LTE TDD | B42 |
WCDMA | B1/5/8 |
Operation Mode | NSA&SA |
Antenna | 6+1 (GNSS) |
Power Supply | 3.3V~4.4V,Typical 3.8V |
Operating Temp. | -30°C - +75°C |
NR MIMO | DL 4x4 MIMO: n3/77/78/79 |
LTE MIMO | DL 4x4 MIMO: B1/3/42 |
NR SA(Mbps) | 4670(DL)/1250(UL) |
NR ENDC(Mbps) | 4470(DL)/730M(UL) |
LTE(Mbps) | 1600(DL)/211(UL) |
WCDMA(Mbps) | 42(DL)/11(UL) |
Voice | VoLTE |
SMS | SMS over IP(IMS) & SMS over NAS |
Audio | ● |
FOTA | ● |
OS Drivers | Linux |
GNSS | GPS/GLONASS/Galileo/BeiDou/QZSS |
USB | USB3.1 |
PCle | PCle3.0 |
UART | ● |
SPI | ● |
GPIO | ● |
I2C | ● |
SDIO | ● |
UIM | ● |
I2S | ● |
MIPI | ● |
RGMII | SGMII/HSGMII |
Regulation | JATE/TELEC |
Operator | DoCoMo |
Industry | NA |